CodeTabelle
# | Gruppe | Beschreibung | Code |
---|---|---|---|
1 | Main function | Force transfer using high-modulus adhesives | F |
2 | Deformation compensation using low-modulus adhesives (thick film bonding) | D | |
3 | Sealing | S | |
4 | Large-area adhesive bonding (e.g. lamination) | L | |
5 | Pre-treatment methods | Blasting | BL |
6 | Etching, anodization | ET | |
7 | Plasma treatment (AD plasma, corona, flame treatment, flame pyrolysis) | PL | |
8 | Laser treatment | LS | |
9 | Production methods | Use of solvent or water based systems (primer, adhesives, cleaning agents, etc.) | SO |
10 | Processing of 2-component-adhesives | TK | |
11 | Processing of 1-component moisture/humidity activated systems (adhesives, primers) | HU | |
12 | Processing of heat-curing adhesives | HE | |
13 | Processing hotmelts | HM | |
14 | Processing of radiation-curing adhesives | RA | |
15 | Processing of anaerobically curing adhesives | AN | |
16 | Lamination or processing of pressure-sensitive adhesives | LA | |
17 | Test methods | Destructive test methods | DT |
18 | Non-destructive test methods (comment required) | NDT | |
19 | Visible inspection (with inspection instructions) | VIS | |
20 | Application monitoring using electrical data processing techniques | DC | |
21 | Cyclic-mechanical ageing tests (oscillation) | CY | |
22 | Crash/impact test methods | IM | |
23 | Physical-chemical ageing tests | PC | |
24 | Rheological measurements | RH | |
25 | Spectroscopic analyses (IR, UV-VIS) | RS | |
26 | Thermal analytical methods (DSC, DMA, TGA, etc.) | TA | |
27 | Wetting measurements | WT | |
28 | Degree of mechanization | Mechanized/automated | VM |
29 | Partly mechanized | TM | |
30 | Manual | M |
DIN 6701
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